…As compute performance scales, the bottlenecks have shifted toward data movement, power efficiency, and system integration. By combining high-speed IP, agentic AI-driven design tools, and advanced packaging technologies, Synopsys and…
…As a result, AI-enabled EDA tools are becoming critical to reducing development cycles and improving productivity. Siemens emphasized that its AI technologies are being integrated directly into production-proven tools such…
… Key Responsibilities : • Manage the full lifecycle of Windows Server OS environments, including installation, configuration, patching, performance tuning, and security hardening. • Deploy, configure, and maintain layered applications, including middleware e.g., .NET, IIS , enterprise software e.g.,… …
…Multiphysics and AI-Driven Design Innovations Synopsys and TSMC are advancing multiphysics analysis for complex, hierarchical 3DIC designs. The multiphysics flow integrates tools like Ansys RedHawk-SC ™, Ansys RedHawk-SC Electrothermal ™, and…
… Synopsys is expanding integrations for compute-intensive workloads, including EDA, test, and manufacturing tools. …
…integration. • Solid understanding of general system administration and solutions architecture principles, including server configuration, storage provisioning, and network integration to ensure robust storage operations. • Experience with automation tools like Ansible and Python…
…PICO represents a structured, pre-silicon flow that spans process assumptions, cell library development, IP integration, toolchain validation, and even 3DIC packaging studies. It ensures all components from transistor to tools are…
…and back-end design further amplify these efforts. RTL design demands excellence to avoid costly respins, with Synopsys’ integrated flows leveraging AI-driven verification for seamless simulation across chiplets. Back-end tools…
The 2026 Design Automation Conference (DAC 2026) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and system-level optimization redefine the future of…
…Announced during the TSMC OIP Ecosystem Summit last week, this collaboration leverages Synopsys’ EDA tools and IP solutions alongside TSMC’s cutting-edge processes and packaging technologies. The result? Accelerated innovation that…