… Computational HBM may be a better way to describe cHBM. This paradigm emphasizes workload-aware partitioning across logic and memory, where memory becomes an active participant in AI processing, not just a passive storage layer. Right now, hyperscalers may be the main drivers for cHBM. …
… The HPC platform diagram illustrates how advanced logic dies, high-bandwidth memory HBM , and photonic components are integrated into a single package to maximize compute density and efficiency. The scaling of interposer size is a key enabler of this integration. …
… This shift toward system-level integration is essential because memory bandwidth has become one of the primary bottlenecks in AI computing. Modern AI accelerators require rapid movement of data between processors and high-bandwidth memory HBM . …
… It is memory, specifically high-bandwidth memory HBM . The average AI accelerator is expected to integrate roughly 250 HBM dies by 2030. NVIDIA’s Rubin Ultra-class designs are projected to approach approximately 1 TB of HBM through higher stack counts and heights. …
… High Bandwidth Memory HBM has been a cornerstone of AI advancement, enabling high-speed data access with low latency, which is critical for AI workloads. In this discussion, panelists examined the role of HBM in AI and the ongoing debate between traditional HBM and custom HBM cHBM solutions. …
… He started his career at Intel where he led next generation GPU to HBM interconnect technology development and the commercialization of their first Silicon-photonics-based transceivers. …
… HBM is a popular standard for integrated memory in multi-die designs. The standard defines an interface for 3D-stacked synchronous dynamic random-access memory DRAM dies. It specifies the PHY-level logic-to-memory interconnection. …
… Integrating real-world workloads prevents bottlenecks in memory bandwidth and thermal management. …
… The company highlighted increasing adoption of chiplet architectures and high-bandwidth memory HBM integration as major technology trends influencing next-generation ASIC development. …
… A standout feature of the collaboration is the focus on 3D integration, addressing the limitations of traditional 2D scaling. …