What Winemakers and Chip Designers Have in Common - Semiwiki
… Thermal management evolves from a secondary operational concern into a primary architectural constraint. …
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Scaling AI Infrastructure with Next-Gen Interconnects - Semiwiki
… Though more complex and costly due to thermal modeling and bonding challenges, 3D stacking enables re-usable, scalable chiplet architectures. …
Automotive Functional Safety (FuSa) Challenges - Semiwiki
… 3D ICs introduce thermal management challenges that require effective cooling methods to ensure reliability and longevity, which is especially critical for the battery life and thermal stability of electric vehicles. …
CEO Interview with Baratunde Cola of Carbice - Semiwiki
… In aerospace and defense, the concern is reliability under extreme conditions. You can’t send a technician to fix a satellite. You can’t swap out a thermal pad in a deployed military system. …
ASML High-NA EUV is Not Ready for High-Volume Production - Semiwiki
… That decision reflects concerns not only about technical maturity, but also about economic return. …