…Topics typically include system-level design trade-offs, strategies for integrating CPUs into complex SoCs, software enablement challenges, and lessons learned from production deployments. The first events in the series were scheduled…
Responsibilities Our team, part of Keysight Laboratories’ High Frequency Technology Center (HFTC), builds and supports software solutions that help manufacture and test integrated circuits made in Keysight’s Santa Rosa wafer fabrication…
…The combination of advanced process technologies, heterogeneous integration, advanced packaging, and increasingly complex customer designs will require a comprehensive approach to manufacturing analytics. Companies that can transform vast amounts of production data…
…Product Management and Systems Solutions. Compounding Complexities Drive Advances in HAV The rapid evolution of semiconductor technology is driven by four compounding complexities: software, hardware, interface, and architecture. As modern chips integrate…
…Compared to 2.5D solutions, 3D integration supports significantly higher bandwidth and tighter physical proximity. However, the benefits come with challenges: thermal hotspots, TSV congestion, and signal integrity must be carefully managed…
Synopsys recently held a webinar session on this topic and Gustavo Pimentel, Principal Product Marketing Manager at the company led the webinar session. Going into the webinar session, I found myself wondering…
…I chatted with Shekhar Kapoor, Executive Director, Product Management at Synopsys to gain additional insights for this purpose. The Hurdles of Multi-Die Solutions in the Past Multi-die solutions have long…
…The partnership combines Akeana’s high-performance RISC-V compute platform with Samsung Foundry’s advanced process technologies and ecosystem infrastructure, providing customers with a streamlined path from architecture to production. As…
…We moved from single-core to multicore processors, from ASIC-centric designs to IP-based SoCs, and from monolithic integration to heterogeneous architectures. Today, another transition is underway, one that may ultimately…
…Domain-specific accelerators, near-memory compute, and chiplet-based 3D integration all play a role, but Godwin emphasized that the real breakthrough comes when AI-driven electronic design automation (EDA) is applied…
