Library Characterization gets a Boost from AI - Semiwiki
…It supports all standard data structures, including NLDM, CCS, and LVF, ensuring that the AI-generated models are signoff-ready. Speed is not helpful if the data is flawed, and at advanced…
Search
Carbon in the Age of AI Chips: What the Semiconductor Industry Needs to Know This Earth Day - Semiwiki
…Using teardown-based analysis of AI PCs including recent Microsoft Surface and ASUS Zenbook models, the report finds a consistent pattern: memory and storage, not the headline processor or NPU, account for…
S2C, MachineWare, and Andes Introduce RISC-V Co-Emulation Solution to Accelerate Chip Development - Semiwiki
…Its flagship platform, SIM‑V, delivers industry-leading RISC‑V simulation performance and extensibility, enabling accurate modeling of complex SoCs and custom ISA extensions. The company serves diverse sectors including AI, automotive…
#DAC2026 Marks Another Pivotal Moment for the Semiconductor Industry - Semiwiki
…3D IC , AI , Chiplet , Events Key takeaways ▼ The 2026 Design Automation Conference ( DAC 2026 ) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and…
The Shift to System-Level AI Drives Next-Generation Silicon - Semiwiki
…From Model Scaling to System Scaling Over the past several years, AI progress was largely driven by scaling models. In other words, expanding parameter counts, improving training methods, and unlocking new reasoning…
Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation - Semiwiki
…The discussion highlighted how AI is transforming chip design decision-making through advanced reasoning models that optimize design trade-offs and system performance. Panelists also examined strategies to reduce AI model training…
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC - Semiwiki
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC by Daniel Nenni on 05-20-2026 at 10:00 am View Forum Posts View Articles Private Message Categories: 3D IC , Chiplet…
Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions - Semiwiki
…designed for electromagnetic modeling, is certified for TSMC’s N5 and N3P processes, supporting system-on-chip electromagnetic extraction. These certifications enable designers to meet stringent requirements for AI, high-performance computing…
What Winemakers and Chip Designers Have in Common - Semiwiki
What Winemakers and Chip Designers Have in Common by Daniel Nenni on 05-22-2026 at 6:00 am View Forum Posts View Articles Private Message Categories: 3D IC , AI , Analog Bits…
Why Europe Needs Its Own AI Supercomputing Platform - Semiwiki
…Training and deploying large AI models require enormous amounts of processing capability, memory bandwidth, and energy-efficient architectures. Rack-scale AI systems — where compute, networking, and memory are tightly integrated at the…