Intel 18A Details & Cost, Future of DRAM 4F2 vs 3D, Backside Power Adoption (or Not), China's FlipFET, Digital Twins from Atoms to Fabs, and More
… SK Hynix highlighted a few key challenges in scaling beyond 1d: Cell contact areas, in particular the storage node contact where the storage capacitor connects to the control transistor below, shrink quadratically with cell critical dimension. …