Scaling the Memory Wall: The Rise and Roadmap of HBM
… This TSV process is one of the key differences between standard DRAM, and tooling for this is the main bottleneck when it comes to converting regular DDR DRAM wafer capacity to HBM capacity. …
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Intel 18A Details & Cost, Future of DRAM 4F2 vs 3D, Backside Power Adoption (or Not), China's FlipFET, Digital Twins from Atoms to Fabs, and More
… TSMC DRAM in BEOL With SRAM bit density no longer increasing with new process nodes, TSMC R&D sought to revive eDRAM to boost chip cache densites. Embedded DRAM was last seen in IBM’s z15 on GlobalFoundries 14nm. …
H100 vs GB200 NVL72 Training Benchmarks - Power, TCO, and Reliability Analysis, Software Improvement Over Time
… Having a publicly available set of benchmark results across the Hyperscaler and NCP providers will dramatically increase the ease of negotiating fair contract prices and speed up decision making. …
Huawei Ascend Production Ramp: Die Banks, TSMC Continued Production, HBM is The Bottleneck
… Domestic HBM Industry - CXMT China's main DRAM player, CXMT, has caught up with the west rapidly. …
The GPU Cloud ClusterMAX™ Rating System | How to Rent GPUs
… The launch of DeepSeek provided a momentary short-term stabilization and even increase in H200 rental prices but in the medium to long term, prices are still declining. …