Huawei Ascend Production Ramp: Die Banks, TSMC Continued Production, HBM is The Bottleneck
… The continued access to TSMC for other Chinese entities decreases the pressure for SMIC to make mobile SoCs, meaning more can be allocated to AI chips. …
… The continued access to TSMC for other Chinese entities decreases the pressure for SMIC to make mobile SoCs, meaning more can be allocated to AI chips. …
… Essentially, as AI chips get more HBM, developers immediately build larger models to fill it, so memory is always the next bottleneck. Let's go through how HBM is used, and where the pressures are. …