… Through this partnership, SK hynix will diversify into new markets NVIDIA is creating — spanning AI infrastructure, personal AI and physical AI — co-developing memory for NVIDIA Vera Rubin AI supercomputers , NVIDIA Vera CPUs , NVIDIA RTX Spark powered PCs , and NVIDIA Jetson Thor robotic computing… …
… By once again positioning himself at the forefront of AI innovation, Chairman Chey further solidified SK hynix’s partnership with NVIDIA, demonstrating his commitment to deepening collaboration with the world’s leading technology companies and taking a leading role in shaping the global AI ecosyste… …
… Alongside the products, an “NVIDIA Partner Sign” bearing the signature of NVIDIA CEO Jensen Huang was placed as a symbolic representation of the strong technology partnership between the two companies. …
… The HBM display zone, positioned at the right corner of the booth, was built around a model replicating the internal structure of NVIDIA’s superchip Vera Rubin, illustrating where HBM4 is integrated and how it supports next-generation AI computing. …
… 2 CoWoS Chip on Wafer on Substrate : TSMC’s 2.5D packaging technology that places a chip on a wafer and then connects it to a substrate. By arranging logic chips and HBM side by side on a single package, it increases data transfer speeds and is considered a key enabler for AI accelerators and HPC. …
… HBM is built by stacking DRAM chips vertically. The pathways that carry signals through these stacked layers are called TSVs Through-Silicon Vias — essentially elevators inside the chip, transmitting electrical signals between floors. …
… Success in the AI era will be determined by the combination of technological innovation to produce better chips and the execution capabilities required to manufacture and supply those chips at scale. …