PRESS SK hynix unveils ‘iHBM’ thermal solution to boost AI performance May 26, 2026 News Highligh ts Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding high-temperature and high-pressure environments Lowe… …
… 7 HBM High Bandwidth Memory : A high-value, high-performance product that vertically connects multiple DRAM chips to increase capacity and dramatically improve data processing speed. HBM has evolved through successive generations: HBM, HBM2, HBM2E, HBM3, HBM3E, and HBM4. …
… 1 HBM High Bandwidth Memory : A high-performance memory solution that vertically stacks multiple DRAM dies to dramatically boost capacity and data throughput. HBM has evolved through six generations: HBM → HBM2 → HBM2E → HBM3 → HBM3E → HBM4. …
… Effectively managing this module will require memory that can perform in-situ computation, pointing toward next-generation HBM post-HBM4 with compute logic embedded in the base die, or PIM Processing-In-Memory 5 technology. …
… SK hynix attributed the honor to its contribution to the global AI computing ecosystem by ensuring the stable mass production of all High Bandwidth Memory HBM generations. …
… 1 HBM High Bandwidth Memory : A high-performance, high-value memory product that vertically stacks multiple DRAM chips to increase capacity and dramatically improve data processing speed. HBM has evolved through successive generations: HBM, HBM2, HBM2E, HBM3, HBM3E, and HBM4. …
… HBM has been developed in sequence: 1st generation HBM , 2nd generation HBM2 , 3rd generation HBM2E , 4th generation HBM3 , 5th generation HBM3E , and 6th generation HBM4 . …
… There are six generations of HBM, starting with the original HBM and followed by HBM2, HBM2E, HBM3, HBM3E, and HBM4. …
… HBM has evolved through successive generations: 1st-gen HBM , 2nd-gen HBM2 , 3rd-gen HBM2E , 4th-gen HBM3 , 5th-gen HBM3E , and 6th-gen HBM4 . “This award is an honor earned through the tenacity and boldness of all SK hynix employees, who have worked tirelessly day and night to create products and … …
… In particular, Lee successfully introduced a packaging technology called MR-MUF 4 during the development of the third generation of HBM—HBM2E—in 2019. This development helped cement SK hynix’s dominance in the HBM market and its position as the leading AI memory provider. …
