… He also shared the progress of partnerships with global automakers and manufacturers across physical AI platforms — including autonomous driving and industrial robotics — and presented a blueprint for building an integrated ecosystem with partners across AI factories and open-source AI models. …
… By extending these tools to the semiconductor electronic design automation and simulation ecosystems, this initiative paves the way for three-way collaborations among chipmakers, NVIDIA and electronic design automation software vendors. …
… Wei in Taiwan to Solidify Global AI Chip Partnership June 3, 2026 SK Group Chairman Chey Tae-won met with TSMC Chairman and CEO C.C. …
… SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips “DRAM” and flash memory chips “NAND flash” for a wide range of distinguished customers globally. …
… 3 3DS 3D Stacked Memory : High-performance memory that vertically connects two or more DRAM chips using TSV Through-Silicon Via . 4 RDIMM Registered Dual In-line Memory Module : A server memory module composed of multiple DRAM chips. …
… 4 3DS 3D Stacked Memory : High-performance memory in which two or more DRAM chips are connected using TSV Through-Silicon Via technology. 5 RDIMM Registered Dual In-line Memory Module : A server memory module product in which multiple DRAM chips are mounted on a substrate. …
… 4 3D Stacked DRAM 3D Stacked DRAM on Logic : A cutting-edge stacking technology that vertically stacks DRAM directly on top of logic semiconductors such as SoC System on Chip . …
… HBM is built by stacking DRAM chips vertically. The pathways that carry signals through these stacked layers are called TSVs Through-Silicon Vias — essentially elevators inside the chip, transmitting electrical signals between floors. …
… Success in the AI era will be determined by the combination of technological innovation to produce better chips and the execution capabilities required to manufacture and supply those chips at scale. …
… This is because Through-Silicon Via TSV technology, which vertically connects stacked chips, increases die size. …