…solution to boost AI performance May 26, 2026 News Highligh ts Enhances heat dissipation by integrating ICEs into the HBM package Reduces thermal resistance by 30%, ensuring stable chip operation in demanding…
…co-packaged optics features in ‘Nature Electronics,’ as AI competition shifts from chips to systems August 20, 2026 TECH&AI AI Infrastructure AI Memory CoPackagedOptics CPO HBM HeterogeneousIntegration NatureElectronics Photonics SK hynix…
…co-packaged optics features in ‘Nature Electronics,’ as AI competition shifts from chips to systems August 20, 2026 TECH&AI AI Infrastructure AI Memory CoPackagedOptics CPO HBM HeterogeneousIntegration NatureElectronics Photonics SK hynix…
…Korea’s semiconductor competitiveness, and a key production hub for supplying the global AI memory market at scale. 1 P&T (Package & Test): A facility that packages semiconductor chips produced in front…
TECH&AI [Expert POV] The real battleground in the AI semiconductor race: Capital and energy infrastructure June 24, 2026 Competition surrounding AI semiconductors has entered a new phase—one that tests not…
…But that requires obtaining huge amounts of data on workload mix collected in the process of cloud service operators managing their services to develop competitive and efficient AI chips. Therefore, AI chip…
…But as AI expands into real-world services and industrial applications, the focus of competition is shifting beyond the performance of individual chips to the architecture of the supporting infrastructure. At the…
TECH&AI SK hynix Showcases Tech Leadership as ‘Full Stack AI Memory Creator’ at HPED 2026, Reaffirming Strong Partnership with HPE June 19, 2026 As competition and collaboration around AI infrastructure continue…
…AI innovation.” About SK hynix Inc. SK hynix Inc., headquartered in Korea, is the world’s top-tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”) and flash memory chips (“NAND…
…In AI systems, this gap can become a bottleneck that limits performance, efficiency and scalability. Ultimately, competitiveness in the AI era depends not only on how fast a chip can compute, but…