Samsung Develops 900-Layer V-NAND Through Advanced Hybrid Bonding Technology
… One of the biggest technical hurdles involves wafer warping. …
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AMD Reengineered Ryzen 7 5800X3D After TSMC Packaging Changes
… However, packaging technology has evolved considerably since the processor launched. As AMD transitioned through subsequent Ryzen generations, TSMC introduced updated wafer stacking and bonding processes. …
Swissbit Launches N7000 PCIe 4.0 SSD Series With Up to 10 DWPD
… Higher-endurance variants, the N7600 and N7601, use pSLC technology to significantly improve durability, reaching endurance ratings up to 10 DWPD. …
Kioxia Details 332-Layer BiCS10 NAND for Future PCIe Gen6 SSDs
… These improvements are particularly relevant for enterprise storage environments where operational costs and reliability are critical factors. …
Intel Launches 18A-Based Xeon 6 Plus with Up to 288 E-Cores
… Intel combines multiple advanced manufacturing technologies to assemble the processor. Twelve compute tiles produced on Intel's 18A process are attached using Foveros Direct 3D stacking to three active base tiles manufactured on Intel 3. …
KIOXIA EXCERIA PRO G2 (PCIe Gen 5.0 NVMe SSD @ 14,9 GB/s) review
PCIe Gen5 Storage Hits 14.9 GB/s with BiCS8 NAND The PCI Express 5.0 SSD market has evolved rapidly, though not always of us Guru's with the current Ai boom . …
NVIDIA GeForce 596.49 WHQL driver download
… NVIDIA is positioning DLSS 4 as a primary technology for improving frame rates in demanding scenarios involving ray tracing and high refresh-rate gameplay. …
ASUS ROG Crosshair 2006 (20th anniversary) X870E review
… Storage and expansion connectivity are equally uncompromising. …
Sapphire PULSE Radeon RX 9070 GRE review
… AMD also leans heavily into FSR technologies with this launch. …