Intel Reportedly Urging OEMs Toward Faster Adoption of 18A Consumer CPUs
Intel is reportedly encouraging major PC manufacturers to accelerate the transition toward consumer processors based on its Intel 18A manufacturing process. …
Search
TSMC Converts 28nm Capacity to 4nm as 1.4nm Plans Advance
TSMC is reportedly accelerating its advanced semiconductor manufacturing expansion as demand for AI processors, HPC accelerators, and modern mobile chips continues increasing across the industry. …
ASML Partners With Tata Electronics on India Semiconductor Fab Initiative
… Automotive systems, industrial machinery, networking equipment, embedded devices, and power management controllers all continue to rely heavily on these manufacturing processes. …
Samsung Develops 900-Layer V-NAND Through Advanced Hybrid Bonding Technology
… Since then, the bonding process has reportedly been refined further to support substantially higher layer counts and improved manufacturing stability. …
AMD EPYC Venice Reportedly Combines TSMC N2P and N2 CCD Designs
… N2P is expected to be an optimized derivative of TSMC’s base N2 process, providing improvements in power efficiency and performance characteristics while remaining within the broader 2 nm manufacturing family. …
Motherboard Market Declines as Rising Component Costs Hurt PC Demand
… This has increased pricing pressure on consumer-oriented products such as DRAM modules, desktop processors, SSDs, and graphics cards. The continued shortage of advanced memory and silicon manufacturing capacity is reportedly driving retail prices higher throughout the PC hardware market. …
AMD EPYC Venice Enters Production on TSMC 2nm Process
… AMD states that the processor is the first high-performance computing product to enter production on TSMC’s 2nm process. …
Intel Razor Lake-AX Rumored to Revive On-Package Memory Strategy
… The last Intel client processors to feature on-package memory were the Lunar Lake Core Ultra 200V chips, which integrated LPDDR5X-8533 memory directly inside the processor package alongside CPU, GPU, and I/O dies. …
Huawei Targets 1.4nm-Equivalent Chip Density Without Advanced EUV Tools
… These processors have reportedly been deployed across smartphones and AI computing products. The company also revealed that its next-generation Kirin processor, expected later in 2026, will become the first flagship chip to fully implement “Logic Folding” technology. …
Microsoft Tests Automatic Windows Driver Rollback Recovery Through Cloud Updates
… The process applies specifically to drivers distributed through Windows Update by hardware manufacturers. …