TSMC Converts 28nm Capacity to 4nm as 1.4nm Plans Advance
… Demand for advanced manufacturing capacity has increased significantly due to rapid AI infrastructure expansion and high-performance computing deployments. …
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Nvidia CEO Now Compares Aging GPUs To Fine Wine
… As organizations continue scaling AI deployments, pricing pressure across multiple segments of the hardware industry is expected to remain elevated. Source: ithome Share this content Twitter Facebook Reddit WhatsApp Email Print LG Launches New Smart Monitor Series With webOS And 4K Model
Samsung Q1 2026 Results Driven by AI Memory Demand Surge - 50x Memory profits
… The company’s current trajectory suggests that AI infrastructure expansion will continue to dominate the semiconductor landscape, with memory supply becoming one of the most critical constraints in the years ahead. …
Akasa Introduces Realtek RTL8127AT-Based Low-Power 10GbE PCIe LAN Card
… Products like the AK-PCCE10-01 reflect the continuing shift of Multi-Gig and 10GbE networking into the mainstream desktop market. Source: Akasa Source: Akasa Share this content Twitter Facebook Reddit WhatsApp Email Print Huawei Targets 1.4nm-Equivalent Chip Density Without Advanced EUV Tools
GEEKOM Refreshes A9 Max Mini PC With AMD Ryzen AI 9 HX 470
… Source: geekom Share this content Twitter Facebook Reddit WhatsApp Email Print iiyama Launches 800g OLED Copilot+ Notebooks With Intel Core Ultra CPUs AMD Expands Ryzen PRO 9000 Series With Commercial X3D Processors
MSI Unveils EdgeMesa N AI+ Mini PC Powered by NVIDIA RTX Spark
… Source: MSI Share this content Twitter Facebook Reddit WhatsApp Email Print MediaTek Confirms Cheaper Nvidia RTX Spark Chips With Twelve Cores NVIDIA RTX 50 SUPER Graphics Cards Reportedly Back on Track
NAND chip revenue in Q1 2026 was higher than the total revenue for the entire year of 2023
… The primary catalyst behind this growth is the rapid expansion of artificial intelligence infrastructure. Large AI models require enormous amounts of high-performance storage to support training, inference, and data management workloads. …
XFX Launches Radeon RX 9070 GRE SWIFT Triple Fan Graphics Cards
… The substantial heatsink assembly occupies three expansion slots and measures 301mm in length, 153mm in width, and 59mm in thickness. The large cooler is intended to maintain stable operating temperatures during demanding gaming sessions and sustained workloads. …
AMD Non-Committal on FSR 4.1 Support for RDNA 3.5 Integrated Graphics
… Source: hwlux via ithome Share this content Twitter Facebook Reddit WhatsApp Email Print Intel Nova Lake-S Platform Emerges with New LGA 1954 Socket Asetek Unveils Emma V3 Gen10 AIO Platform with Lower Noise and Improved Thermal Performance
DeepCool Launches CC550 4F Mid-Tower with Four Included ARGB Fans
… Specification DeepCool CC550 4F Case Type Mid-Tower Motherboard Support ATX, Micro-ATX, Mini-ITX Pre-Installed Fans 4 × 120 mm ARGB Front Fan Support 3 × 120 mm Top Fan Support 2 × 120/140 mm Bottom Fan Support 2 × 120 mm Rear Fan Support 1 × 120 mm Maximum GPU Length 317 mm Maximum CPU Cooler Heig…