SanDisk Proposes HBF NAND Stacks Beneath GPUs for AI Systems
… Feature Details Technology Name High-Bandwidth Flash HBF Developer SanDisk Memory Type Stacked NAND Flash Interconnect Through-Silicon Vias TSVs Maximum Projected Capacity Up to 4 TB per stack Companion Memory HBM DRAM Package Integration CMOS Bonded Array CBA GPU Placement NAND Positioned Beneath …