… It is claimed that this partnership is driven by India's ISM mission, introduced by Prime Minister Narendra Modi in 2021, which aims to boost domestic semiconductor fabrication, design, and packaging. …
With aggressive AI demand burdening TSMC's packaging resources, supply chain reports from Taiwan continue to suggest that Intel's EMIB-T packaging technology is gaining traction with Google. …
… In its coverage, the bank's analyst points out that the capacity for TSMC's advanced CoWoS packaging technology could grow significantly due to tailwinds from AI in 2026 and 2027, with other technologies such as system on integrated chips SoIC and chip-on-panel-on-substrate CoPoS can drive demand i… …
… Read all comments on NVIDIA Looks to Intel’s 18A/14A Process and EMIB Packaging for Next-Gen Feynman AI Chips, Signaling a Major Foundry Shift Beyond TSMC
… In the longer run, Intel has Celestial and Druid GPU lineups planned, but specific information remains uncertain. However, with the NVIDIA partnership, we definitely expect development around Intel's desktop GPUs to remain a lot more confined, especially since the competition would be a lot tighter. …
Apple's probable return to Intel's fabs is not a threat to TSMC, which remains the "most trustworthy AI compounder," according to a new research report from Bernstein SocGen Group. …
… Essentially, Apple realized that TSMC would continue to allocate an increasing share of its resources towards AI and HPC workloads, making it an imperative for Apple to find a viable alternative while its bargaining power remained high. …
… Read all comments on Apple Quietly Courts Intel And Samsung For Its Most Critical Chips As TSMC’s Advanced Nodes Remain Choked Under AI Demand
… We don't know how the agreement will turn out regarding the revenue share of chips produced at the facility, but we will have to wait and see for more details. …
… Lip-Bu Tan - Intel CEO Another major technology that is talked about by Lip-Bu is EMIB, which he calls one of the most advanced and best technologies for chip packaging. EMIB was recently said to have reached 90% yields and is aiming for the next milestone to make it viable for external customers. …
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